Our Products

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Small Outline Packages

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Power Packages

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QFN

Product & Process Capability

Small Outline Packages

– High Density Leadframes

– 12inch wafer saw and die attach

– 100um wafer thickness handling at saw

– 30um Saw Street Sawing

– Epoxy, Eutectic, Soft Solder

– Au & Cu Wire min 0.8mils wire

– Fine pitch 35um bonding capability

– Bond placement accuracy 3um

– Automated Optical Inspection

– Auto-mold system

– In-house strip plating

– Zero delamination process

Power Packages

– SiC wafer Saw

– 100um wafer thickness handling at saw

– Soft Solder Die Attach

– Al wire 5mils to 25mils

– Bond placement accuracy 3um

– Integrated Non Destructive Pull Test

– Automated Optical Inspection

– Conventional mold system

– In-house strip plating

– Zero delamination process

– AECQ Qualification

QFN

– High Density Leadframes

– Scalability 1×1 ~ Max 17×16

– 100um wafer thickness handling at saw

– Epoxy, DAF, WBC

– Au & Cu Wire min 0.8mils

– 8 tiers wire looping, > 3000 wires

– Automated Optical Inspection

– Auto-mold system

– In-house strip plating

– Zero delamination process