Manufacturing process Flow

Manufacturing Process Flow

Front End Assembly (FOL)

Wafer Sawing and Cleaning

Features

Fully Automatic Dicing Saw

Improved productivity with Φ300 mm wafers
Dual cut processing speed due to the shortened distance between the spindles.
Throughput improvement of approx. 7% compared to the previous model.
Improves full cleaning capabilities (wheel cover effective against particle adhesion)
Advanced graphical operation software
Cutting speed, up to 1,000mm/s

CO2 Injector Resistivity Management Unit

StayClean Injector (Water-soluble Additive)

SiC Wafer Sawing capability

Front End Assembly (FOL)

Die Attach Process

Process Technology

Epoxy, Eutectic, Soft Solder ,WBC Die Attach

State of Art Die Attach Machine & Process

Premium automotive grade die attach materials
High performance pick and place
Auto-adjusting pick-up tool offsets and dispense pressure after syringe change.
Able to handle Wafer Size: 4” - 12”
Die Size: 0.5 - 20 mm
Die Thickness: > 0.075 mm
Pre-bond, post bond inspection quality checks
Die Shear monitoring with Dage Shear Tools

Front End Assembly (FOL)

Wire Bond Process

Process Technology

Au, Cu and Al wirebond technology

Au, Cu WireBond Process

Premium automotive grade wirebond materials
Ultra Fine Pitch,bond pad pitches as fine as 35 μm.
Wire sizes from 0.6 mil to 2.5 mil
Bond placement accuracy of 2.0 μm at 3 sigma.
Ultra-low loop capability with a minimum height of 40 μm using 0.6 mil wire.
Enhanced Post-Bond Inspection: Ensures the quality of the bonds with advanced inspection capabilities.

Al WireBond Process

Large Wire Range: 100μm - 500μm Diameter
Ribbon Range: 500 x 100μm to 2000 x 250μm
Small Wire Range: 25μm - 75μm Diameter
In-line Transport Pulltester, Pull force: 20-500g, nondestructive Up to 4 pulltesters per bonder module
Loop height check

Front End Assembly (FOL)

Automated Optical Inspection

Cutting-edge AOI for inspecting critical components in semiconductor manufacturing.
Detailed and accurate inspection of wirebond, die, and epoxy features for enhanced defect detection.
High-Resolution Imaging up to 67 megapixels, ensuring high-quality imaging for precise inspection and analysis.
Inspects wirebonds made from various materials, including gold, aluminum, copper, and silver.
Precisely measures essential parameters such as ball, wedge, stitch, and loop characteristics
Capable of detecting various defects in wirebond connections, die attachment, and epoxy application.
Achieves an accuracy of up to 2.7 micrometers per pixel, ensuring reliable inspection results even for minute features.

BackEnd Assembly (EOL)

Molding Process

Process Technology

All-in-one transfer molding system for high quality molding

Applicable for large lead frames 100×300 mm.
High-rigidity press structure (hold frame), achieve an uniform clamping surface pressure, an optimal path line and a compact footprint.
Release film compatible (side gate systems).
Side gate/top gate applicable.
Modular press supporting different production quantities.

BackEnd Assembly (EOL)

Dejunk Process

Process Technology

High precision dejunk process for effective dambar and gate removal

Orientation check by vision.
Auto adjustable design for other PKG type (Onloader M/Z, Track width)
Uncut dambar check by vision.
Feeding : Gripper feeding to transfer Lead Frames to ease conversion.
Simple Device change type (M/Z,Tool,Tube conversion kits)
Tool ID : RFID type for Tool's part life cycle

BackEnd Assembly (EOL)

Laser Marking Process

Process Technology

State of Art Machine & Process

BackEnd Assembly (EOL)

Plating

Process Technology

State of Art Machine & Process

Capable of handling any leadframe product up to 110 x 315 mm.
Uses an endless carrier belt to transport leadframes through various processing stages, ensuring consistent quality. Specially designed to hold leadframes in mechanical and electrical contact.
The continuous processing ensures that each leadframe experiences the same plating conditions, resulting in consistent quality. Recipe-controlled.
Integrated switches to stop production and trigger alarms if levels are too low1.
Transports leadframes at speeds up to 8 meters per minute.
Height Adjustable Overflows: Plating sections have height adjustable lengthwise overflows.
Polypropylene: Used in electro-chemical, chemical, rinse, and dragout sections.
Batch Control: Ensures no inter-mixing between leadframes from different cassettes.

BackEnd Assembly (EOL)

Trim and Form

Process Technology

State of Art Machine & Process

Orientation check by vision.
Uncut dambar check by vision
Bent lead and Lead to Lead dimension check by vision.
RFID type for Tool's part life cycle
Mechanical Press, Power : Max.5Tons
Horizontal Tube Offloader (Tube pallet type)
Auto adjustable design for other PKG type (Onloader M/Z, Track width)
Strong Vacuum suction
Simple Device change type (M/Z,Tool,Tube conversion kits)

Final Test

Discreet & Analog Turret Platform

Input

Output

Processes

Device Orientation
Device Flip
Test Contact up to 8 stations
Laser marking
6 Sides Vision inspection
In-Tape inspection with Auto-Reject and Replacement
Bulk, Tube sorting

(+91) 93274 18753

Manufacturing process Flow