(+91) 93274 18753

Our Products

  1. Home
  3. Our Products

Our Products

Small Outline Packages

Power Packages

QFN

Product & Process Capability

Small Outline Packages

– High Density Leadframes
– 12inch wafer saw and die attach
– 100um wafer thickness handling at saw
– 30um Saw Street Sawing
– Epoxy, Eutectic, Soft Solder
– Au & Cu Wire min 0.8mils wire
– Fine pitch 35um bonding capability
– Bond placement accuracy 3um
– Automated Optical Inspection
– Auto-mold system
– In-house strip plating
– Zero delamination process
Know More

Power Packages

– SiC wafer Saw
– 100um wafer thickness handling at saw
– Soft Solder Die Attach
– Al wire 5mils to 25mils
– Bond placement accuracy 3um
– Integrated Non Destructive Pull Test
– Automated Optical Inspection
– Conventional mold system
– In-house strip plating
– Zero delamination process
– AECQ Qualification
Know More
QFN

QFN

– High Density Leadframes
– Scalability 1×1 ~ Max 17×16
– 100um wafer thickness handling at saw
– Epoxy, DAF, WBC
– Au & Cu Wire min 0.8mils
– 8 tiers wire looping, > 3000 wires
– Automated Optical Inspection
– Auto-mold system
– In-house strip plating
– Zero delamination process
Read More
  • High Density Leadframes
  • 12inch wafer saw and die attach
  • 100um wafer thickness handling at saw
  • 30um Saw Street Sawing
  • Epoxy, Eutectic, Soft Solder
  • Au & Cu Wire min 0.8mils wire
  • Fine pitch 35um bonding capability
  • Bond placement accuracy 3um
  • Automated Optical Inspection
  • Auto-mold system
  • In-house strip plating
  • Zero delamination process
Learn More
  • SiC wafer Saw
  • 100um wafer thickness handling at saw
  • Soft Solder Die Attach
  • Al wire 5mils to 25mils
  • Bond placement accuracy 3um
  • Integrated Non Destructive Pull Test
  • Automated Optical Inspection
  • Conventional mold system
  • In-house strip plating
  • Zero delamination process
  • AECQ Qualification
Learn More
  • High Density Leadframes
  • Scalability 1×1 ~ Max 17×16
  • 100um wafer thickness handling at saw
  • Epoxy, DAF, WBC
  • Au & Cu Wire min 0.8mils
  • 8 tiers wire looping, > 3000 wires
  • Automated Optical Inspection
  • Auto-mold system
  • In-house strip plating
  • Zero delamination process
Learn More
Suchi Semicon Pvt Ltd is driven by a mission to become a leading Semiconductor Assembly and Test (OSAT) service provider, specializing in advanced IC packaging solutions and comprehensive test services to support the semiconductor industry.

Quick Links

Security

Contact

(+91) 93274 18753

info@suchisemicon.com

Suchi House, Near Golden Plaza Market, Ring Road, Surat, Gujarat, India 395002

Copyright © 2025 All Rights Reserved.

Mr. Ashok Mehta

MD - Suchi Industries

A visionary entrepreneur from Surat, he ventured into Import and Export, covering over 30 countries and establishing a global reputation. In 2004, he founded Suchi Industries, reputation his extensive global experiences into a successful business. Currently, he leads a team of 700 direct and 1000 indirect employees, showcasing his profound knowledge and dedication. His business success is a testament to his sheer hard work and steadfast sincerity.