– High Density Leadframes
– 12inch wafer saw and die attach
– 100um wafer thickness handling at saw
– 30um Saw Street Sawing
– Epoxy, Eutectic, Soft Solder
– Au & Cu Wire min 0.8mils wire
– Fine pitch 35um bonding capability
– Bond placement accuracy 3um
– Automated Optical Inspection
– Auto-mold system
– In-house strip plating
– Zero delamination process
– SiC wafer Saw
– 100um wafer thickness handling at saw
– Soft Solder Die Attach
– Al wire 5mils to 25mils
– Bond placement accuracy 3um
– Integrated Non Destructive Pull Test
– Automated Optical Inspection
– Conventional mold system
– In-house strip plating
– Zero delamination process
– AECQ Qualification
