What we offer

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Suchi Semicon Offering

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IC Packaging Processes

  • Wafer Probing.
  • Wafer Back Grinding.
  • Assembly (FOL & EOL)
  • Strip Plating  
  • Electrical Testing (FT)
  • Strip Marking  
  • Tube/ Tape & Reel/ Tray Packing
  • Drop shipment to end customers
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    IC Packaging Development

  • Lead-frame design
  • Material qualification
  • Test development
  • Product labeling   
  • Change Management
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    Value Add Services

  • Reliability Lab  
  • Failure Analysis Lab 
  • Return Material Authorization  
  • Raw materials custom clearance 
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    Customer Support

  • Warehouse/ FG Storage  
  • Wafer storage in N2 Cabinet
  • Consigned machine mgmt.
  • Customer office
  • Marketing & Sales