Our semiconductor packaging company offers tailored design services to meet each customer’s unique needs. We utilize industry-leading design tools to ensure precision and quality. Our exceptional project management methodology guarantees timely delivery of projects, ensuring that every aspect of the design process is handled efficiently and effectively.
3D moldflow simulation can streamline the process of optimizing design, material, and procedures to minimize defects, thereby reducing the need for a large DOE matrix. This simulation technique significantly shortens the design-to-implementation cycle, pinpointing critical issues before the actual fabrication begins.
We provide cutting-edge Thermal Analysis Services tailored to the semiconductor packaging industry’s rigorous demands. Our offerings include thermal performance verification and comparison for various package designs, innovative thermal solutions to enhance overall management and efficiency, and the design of external heat sinks to improve thermal performance. Additionally, we develop compact thermal models for accurate simulations and predictions of thermal behavior under different conditions.
Services in semiconductor packaging focus on evaluating and optimizing the mechanical properties and behavior of semiconductor packages. We offer mechanical analysis services such as Thermal-Mechanical Analysis to assess the impact of temperature changes on the mechanical properties of the package and Finite Element Analysis (FEA) Simulates the mechanical behavior of the package using computational models
