Technical Team Capability

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Technical Team Capability

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Skills & Experience

  • 150+ years in Malaysia semiconductor operations across the full spectrum.
  • Experience in establishing & managing multinational startups & OSAT
    operations.
  • Skilled in designing lead frames for tailored packaging needs.
  • FA, Reliability, FEA, DOE, Weibull analysis.
  • Product qualifications (JEDEC, AECQ).
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Collaboration

  • First-hand experience with market-leading equipment and the latest
    technologies.
  • Good connection with semiconductor leaders and experts.
  • Customer requirements.
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Adaptability

  • Exposure working in different countries.
  • Never Stop Learning
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Leadership

  • Held leadership roles in multinational companies and provided consultancy
    services.
  • Lead projects in many different countries.
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Shared Vision & Goals

  • Capable of producing a wide range of packages including SOSM, QFN, Power, Die
    Sales, and Wafer Probe.
  • Qualify production for commercial and automotive customers.