The escalating demand for smaller, faster, and more powerful electronics has intensified the need for innovative packaging solutions. Engineers are tasked with designing intricate semiconductor packages that can accommodate high-performance components without compromising reliability or structural integrity. To achieve optimal package design, meticulous analysis and simulation of critical package parameters are essential.
Suchi Semicon partners with clients to develop tailored packaging solutions that prioritize performance, quality, time-to-market, and cost-effectiveness. Our comprehensive package design center assist customers in selecting the ideal packaging configuration for their specific end applications.
Innovate package solutions for new customer, device, package
- Process excellence through capable machines and high-grade materials.
- Parameter optimization.
- Technical team competency.
- Lower operation cost without compromise to quality.
- AOI (Front-end), SAT (Delamination)
- Automations – Poka Yoke Operation.
- Output optimization – CT reduction (Kaizen)
- Process Control (Control Plan/FMEA)
- JEDEC/AECQ Qualification.
- FA Capabilities (SEM, Xray, EDX)
-Reliability (MSL, PCT, HAST, HTL, TC, and etc..)
- NPI Process
- Product Release Review
- Manufacturing Readiness & approval.
