Small Outline Integrated Circuit (SOIC) is a type of surface-mount electronic component package used for integrated circuits (ICs)
Compact Size: 30% less area and 70% thinner than DIP.
Lead Configuration: SOIC packages have “gull wing” leads that extend from the two longer sides of the rectangular body.
Pin Spacing: The leads are spaced at 1.27 mm (0.050 inches) apart, which is standard for SOIC packages4.
By Lead Count
• SOIC-8 : 8 leads
• SOIC-14: 14 leads
• SOIC-16: 16 leads
• SOIC-20: 20 leads
• SOIC-24: 24 leads
• SOIC-28: 28 leads
By Width
• Narrow SOIC (SOIC-N)
Body width of 3.9mm
• Wide SOIC (SOIC-W)
Body width of 7.5mm
MSL Level 1
Zero Delamination Process
AECQ100/101 Qualification Options
ROHS Compliance
SOT
Compact Size: SOT packages are small and lightweight, making them ideal for high-density PCB designs1.
Surface Mount: They are designed for surface mounting, which simplifies the assembly process and reduces the need for through-hole components1.
Lead Configuration: SOT packages typically feature gull-wing or J-lead configurations, which provide good mechanical stability and ease of soldering1.
o Lead Count: 3 or 5
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification Options
o ROHS Compliance
o Lead Count: 4 with pitch of 2.3mm
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification Options
o ROHS Compliance
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification Options
o ROHS Compliance
SOP
o Lead Count: 4,8,14,16,20,24,28
o Lead Pitch : 1.27 mm
o Package Thickness : ~1.75mm
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification
Options
o ROHS Compliance
o Lead Count: 20 to 66 leads
o Lead Pitch : 0.5mm
o Package Thickness : ~1mm
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification
Options
o ROHS Compliance
o Lead Count: 8 to 48 leads
o Lead Pitch : 0.5mm
o Package Thickness : less than 1mm
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification
Options
o ROHS Compliance
o Lead Count: 8.10,12,16, 20 leads
o Lead Pitch: 0.65mm
o Package Thickness : less than 1mm
o MSL Level 1oZero Delamination Process
o AECQ100/101 Qualification Options
o ROHS Compliance
o Package Dimensions: 2.6 mm × 1.6 mm
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification Options
o ROHS Compliance
o Package Dimensions: 1.7 mm × 1.25 mm
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification Options
o ROHS Compliance
o Package Dimensions: 1.3 mm × 0.8 mm
o MSL Level 1
o Zero Delamination Process
o AECQ100/101 Qualification Options
o ROHS Compliance
Suchi Semicon Pvt Ltd is driven by a mission to become a leading Semiconductor Assembly and Test (OSAT) service provider, specializing in advanced IC packaging solutions and comprehensive test services to support the semiconductor industry.
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Mr. Ashok Mehta
MD - Suchi Industries
A visionary entrepreneur from Surat, he ventured into Import and Export, covering over 30 countries and establishing a global reputation. In 2004, he founded Suchi Industries, reputation his extensive global experiences into a successful business. Currently, he leads a team of 700 direct and 1000 indirect employees, showcasing his profound knowledge and dedication. His business success is a testament to his sheer hard work and steadfast sincerity.
